SAN LUIS OBISPO, Calif. -- Chemical mechanical planaraization tool maker Strasbaugh Inc. here has entered into a technology alliance with Verteq of Santa Clara, Calif., which will supply wafer cleaning systems for CMP polishers. The partnership comes as a growing number of CMP tool shipments include integrated wafer cleaning systems with the polishing tools.
"We needed an advanced, non-contact, integrated dry-in/dry-out cleaning option that we could adapt to our customers' specific needs," said Duncan Dobson, vice president of sales and marketing at Strasbaugh. He added that Verteq's Goldfinger cleaning system was at the top of Strasbaugh's list of cleaning systems for CMP.
CMP tools are quickly becoming an essential wafer-processing tools as device feature sizes shrink and copper metal interconnect rapidly approaches. These CMP polisher are used to make wafer surface flat between process steps and exposure of patterns with lithography tools. They are also used to create structures, such as copper interconnects in dual damascene processes (see story from June publication of SBN online magazine).
Verteq's Goldfinger CMP cleaning system uses advanced megasonics technology and a robust non-contact process, according to the Santa Clara-based company. The cleaning system is available for 200- and 300-mm oxide and tungsten applications. Verteq said it is now developing a cleaning solution for CMP processes used in copper interconnects.
"We believe combining the unique CMP technologies of the Strasbaugh Symphony polisher with the non-contact Goldfinger cleaning system brings enhanced capabilities to CMP for today's chip manufacturing and for the emerging technologies of 0.13 micron and below," declared John Breslin, CEO of Verteq.
