United Business Media EE Times




Search

HOMELATEST NEWSSEMICONDUCTORSMOST POPULARMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSS

 

Malaysia's 1st Silicon clears first hurdles with fab launch
Facing tough market conditions, foundry startup plans to move quickly to 0.18-micron processes







Silicon Strategies


KUCHING, Malaysia--Foundry startup 1st Silicon (Malaysia) Sdn. Bhd. here is preparing to launch a 0.18-micron process technology close on the heels of its 0.25-micron production ramp, said company officials during a dedication ceremony for a new 200-mm wafer fab today (Feb. 23).

The fab is now ramping production to volume levels using a 0.25-micron CMOS technology, which is licensed from Sharp Corp. of Japan. The company is one of two Malaysian startups aiming to establish a foothold in the competitive foundry business using initial quarter-micron process technologies.

Last week, Silterra Malaysia Sdn. Bhd. announced delivery of 0.22-micron CMOS wafers with customer designs after starting quarter-micron production in its 200-mm (8-inch) wafer fab on the Malay peninsula in the city of Kulim (see Feb. 14 story).

In Malaysia's State of Sarawak, on the island of Borneo, 1st Silicon officially formally dedicated the company's 200-mm plant after starting engineering wafer runs late last year. Officials said the dedication of the facility marks a significant chapter for Malaysia 's 35-year-old semiconductor industry, which has mostly been dedicated to backend chip assembly and packaging operations since the 1970s.

In the summer of 1998, local officials resurrected efforts to build a semiconductor-processing plant in Kuching after the failure of a previous venture, called Interconnect Technology. With new investors, new management and renewed government support, 1st Silicon started up and struck a technology partnership with Sharp (see July 20, 1998, story). Sharp has become 1st Silicon's biggest customer of foundry services to date.

The opening of 1st Silicon finally puts the failure of Interconnect Technology to rest. "I have been dragging the ghost of the former company around from day one," said the chief executive officer of 1st Silicon in an interview last year. "We have had the worst hurdles to jump," said Claudio G. Loddo, who took over as CEO of 1st Silicon in 1998. But all that is now history. What's challenging 1st Silicon today are troubled market conditions as the silicon foundry industry struggles with a major slowdown at the time of the company's fab ramp.

Consequentially, 1st Silicon is planning to quickly move to its next-generation 0.18-micron technology after ramping initial digital and mixed-signal ICs with its current 0.25-micron CMOS.











  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Ready for a change?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
10 Search Engines You Don't Know About
Go beyond Google and get vertical. These specialized search sites will help you find the business information you need -- fast.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   


  Around Silicon Strategies

Challenges for 22-nm node: A team of expert analysts from Semiconductor Insights--Xu Chang, Vu Ho, Ramesh Kuchibhatla and Don Scansen--came up with a list of top challenges for the 22-nm node. Here's a list of 15 challenges (and more). More...

10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

Top 20 chip suppliers: Six of the top 10 IC companies are expected to suffer revenue declines in 2008, with the broader industry hamstrung by a ''disastrous'' year for the memory chip segment, according to iSuppli's preliminary rankings of the top 20 chip suppliers. More...

We want change!: More calls for a change in engineering education surfaced at the recent International Electron Devices Meeting (IEDM). Change is needed to become more competitive. Also see the stream of letters on the subject. More...

Hot technologies to watch for in 2009: Every technologist, marketer, industry analyst and reporter on a hunt for the next big thing is bracing for the 2009 Consumer Electronics Show scheduled less than a month away. More...

Top 20 predictions for semis in 2009: To help sort out the confusion in the market, EE Times has released its own chip forecasts--and other predictions--for 2009. So, what will happen in analog, FPGAs, foundry, memory, MPUs and other sectors? More...

Silicon 60 version 7.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 7.0 to reflect the latest corporate, commercial, technology and market conditions. More...

 

FEATURED TOPIC



ADDITIONAL TOPICS












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2009 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Your California Privacy Rights | Terms of Service | About