IRVINE, Calif.--A system-on-chip development and foundry support alliance has been struck between 3DSP Corp. here and South Korea's Hynix Semiconductor Inc. (formerly Hyundai Electronics Industries).
Under the alliance announced today, Hynix will supply foundry capacity for system-on-chip designs based on 3DSP's configurable, scalable digital signal processor architecture. Hynix also joins the 3DSP Masterpiece partnership program, which supports DSP-based designs with intellectual property (IP) cores and foundry services.
"One of the goals of our Masterpiece partnership program is to make our customers more successful by helping them find the foundry services and capacity they need to get innovative next-generation DSP-based products to market more quickly," said Tom Beaver, chief executive officer and president at 3DSP. Beaver, a former Motorola executive, said his company will work with the Korean chip manufacturer to assist joint customers in applying DSP technology to new products.
