United Business Media EE Times




Search

HOMELATEST NEWSSEMICONDUCTORSMOST POPULARMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSS

 

AMD strikes 'alliance' with Transmeta, licenses 64-bit and bus technologies








Silicon Strategies


SUNNYVALE, Calif.--In a move to increase competition with Intel Corp. in PC processors, Advanced Micro Devices Inc. today announced it has licensed the company's 64-bit x86-64 technology and HyperTransport chip-interconnect format to microprocessor startup Transmeta Corp.

Transmeta, in nearby Santa Clara, plans to use AMD's technologies in future x86-compatible processors to extend its product line from 32-bit to 64-bit computing. AMD and Transmeta described their licensing agreement as an alliance to promote next-generation microprocessor standards.

"AMD's x86-64 instruction extensions provide the best upward compatible path for adding 64-bit address capabilities to the x86 instruction set for the PC industry," said David R. Ditzel, vice-chairman and chief technology officer at Transmeta. The highly publicized startup, which launched its power-stingy Crusoe processor last year, is also moving to AMD's HyperTransport high-speed I/O bus technology to offer faster links between chips inside computers, networking gear, and communications systems.

Last February, AMD launched the HyperTransport bus promising to provide an I/O interconnect format that speeds communications between ICs by up to 48 times, compared to existing bus systems (see Feb. 14 story). AMD is lining up companies to form a HyperTransport bus consortium, which is expected to be launched later this year to derail Intel's 3GIO bus format for next-generation systems.











  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Ready for a change?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
10 Search Engines You Don't Know About
Go beyond Google and get vertical. These specialized search sites will help you find the business information you need -- fast.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   


  Around Silicon Strategies

Challenges for 22-nm node: A team of expert analysts from Semiconductor Insights--Xu Chang, Vu Ho, Ramesh Kuchibhatla and Don Scansen--came up with a list of top challenges for the 22-nm node. Here's a list of 15 challenges (and more). More...

10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

Top 20 chip suppliers: Six of the top 10 IC companies are expected to suffer revenue declines in 2008, with the broader industry hamstrung by a ''disastrous'' year for the memory chip segment, according to iSuppli's preliminary rankings of the top 20 chip suppliers. More...

We want change!: More calls for a change in engineering education surfaced at the recent International Electron Devices Meeting (IEDM). Change is needed to become more competitive. Also see the stream of letters on the subject. More...

Hot technologies to watch for in 2009: Every technologist, marketer, industry analyst and reporter on a hunt for the next big thing is bracing for the 2009 Consumer Electronics Show scheduled less than a month away. More...

Top 20 predictions for semis in 2009: To help sort out the confusion in the market, EE Times has released its own chip forecasts--and other predictions--for 2009. So, what will happen in analog, FPGAs, foundry, memory, MPUs and other sectors? More...

Silicon 60 version 7.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 7.0 to reflect the latest corporate, commercial, technology and market conditions. More...

 

FEATURED TOPIC



ADDITIONAL TOPICS












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2009 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Your California Privacy Rights | Terms of Service | About