United Business Media EE Times




Search

HOMELATEST NEWSSEMICONDUCTORSMOST POPULARMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSS

 

Closer Look: AMD faces DDR-II challenge with its Hammer processor








EBN


The 64-Bit Question for Advanced Micro Devices Inc. is how its new Hammer family of processors will support DDR-II next- generation memory.

DDR-II is expected to go into production in the third quarter of next year, six to nine months after AMD's new desktop Athlon Hammer and its Opteron server/workstation versions launch. But the Hammer chips have the unique architecture of on-die memory controller for the current DDR-I generation. Switching to on-die support for DDR-II requires a new Hammer chip controller design with all that entails.

AMD confirms that Hammer's on-die memory controller now supports only DDR-I, and that DDR-II will require a new Hammer chip design, at least for the memory portion. But the company claimed this was no big deal.

AMD embedded the North Bridge controller on the Hammer chip to gain much faster memory throughput and lower latency and lessen impedance problems -- all increasingly major issues with external chipset controllers. High-speed data signals aren't impeded by the extra connection to an external North Bridge.

AMD doesn't yet reveal how much performance gain the on-die controller brings, but said it is all part of the overall new architecture expected to yield 25% to 30% improvement over the best current processors and chipsets.

It's the classic dilemma between embedded cores that require new chip design to change vs. discrete external chips that give flexibility but at some performance tradeoff.

Intel Corp., of course, faces no such challenge, since the MPU giant relies on external chipsets for all of its processors. New chipsets can be run in to support the latest memory or processor technology interfaces as required.

Embedded DRAMs face the same tradeoff. And because new iterations of DRAMs come so thick and fast and in ever more flavors, the choice is often made simply to skip embedding the memory for whatever increased performance is offered, and stick with discrete DRAM chips.

The issue is joined even more in AMD's Hammer series and the upcoming DDR-II. The next generation memory is expected to offer major enhancements for servers and workstations, one of the big markets AMD is eyeing for its new processors.

AMD said DDR-II won't really hit its market stride until 2004. At that time AMD will be ready with a new iteration of Hammer, which at that point will have been a year or so on the market and ready for upgrade. "We will support DDR-II when it comes into the market," a spokeswoman stressed.

That means AMD has to be on a similar DDR-II testing and qualification timetable right now for Hammer as the infrastructure now starting to gear up with external chipset support for Intel processors. Two DRAM vendors, Samsung Electronics Co. and Elpida Memory, are already starting to sample DDR-II chips to start the infrastructure qualification process. In the next year, chipsets, motherboards and hardware systems will test and validate DDR-II in their products, to be ready for a production pushout after mid-year 2003.

AMD led the major processor push into DDR-I, as Intel was delayed in turning its huge processor battleship around from a sole commitment to RDRAM. The No. 2 MPU firm doesn't want to be upstaged by Intel in the next-generation DDR-II.

But this steeple chase has a new wrinkle. AMD is riding a new entry on-die memory controller horse. So watch the gates when the bell rings for the DDR-II takeoff and contenders head into the first turn.











  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Ready to take that job and shove it?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
10 Search Engines You Don't Know About
Go beyond Google and get vertical. These specialized search sites will help you find the business information you need -- fast.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   


  Around Silicon Strategies

Video--Cypress Semi's T.J. Rodgers: EE Times sat down with T.J. Rodgers, CEO of Cypress, who offered his take on how the current financial crisis will impact the semiconductor industry and how the industry downturn appears different than those of the recent past. More...

10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

Qualcomm leaps: Qualcomm used a 27 percent year-over-year growth rate to jump to ninth among the largest semiconductor suppliers through the first three quarters of 2008, according to a top 20 ranking compiled by IC Insights. More...

35 people, places & things: We are witnessing the integration of technology with society to an unprecedented degree. In this special report, we offer a glimpse of the next 35 years--what's coming down the pike, and how we might begin to make sense of it. More...

Top 10 predictions for semis in 2008: To help sort out chip market confusion, EE Times semiconductor editor Mark LaPedus offers his own chip forecasts--and other predictions--for 2008. So, what will happen to AMD, Freescale, IBM Micro, SMIC and others? More...

Market intelligence: Ethernet is poised to dominate all aspects of networking, but the new speeds will have effects that ripple out in various ways. That's the conclusion of one of several analysis reports available from EE Times Market Intelligence Unit. More...

Silicon 60 version 7.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 7.0 to reflect the latest corporate, commercial, technology and market conditions. More...

 

FEATURED TOPIC



ADDITIONAL TOPICS












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2008 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Your California Privacy Rights | Terms of Service | About