SAN JOSE, Calif. --- Tessera Inc. claims to have developed a package for radio frequency integrated circuits that can save three-quarters of the area and half the cost of conventional RF modules.
The company said it had already provided information about the packaging, which it calls Pyxis, to some customers.
The Pyxis package integrates microBGA technology, flip-chip, integrated passives in silicon and on polyimide, as well as novel EMI shielding techniques, Tessera said. The company is offering to license the technology plus a suite of design tools and libraries to facilitate ease of adoption, the company said.
Tessera has come up with application-specific forms of the package based on required componentry. For example, the Pyxis Power Amplifier platform integrates tri-band GSM/GPRS power amplifiers with their surrounding passive components, the company said.
"Customers and partners with whom we have shared specifics of the package, ranging from RF chipmakers to handset providers and manufacturing houses, view it as a disruptive technology with tremendous market value and potential," said Bruce McWilliams, Tessera chairman and chief executive officer, in a statement.
