PLEASANTON, Calif. -- Advanced Interconnect Technologies Inc. (AIT) said today (April 28, 2003) it has developed a style of package it calls flip-chiip on standard leaded (FCOSL) packages.
These packages use pillar bumping technology from Advanpack Solutions PTE, Ltd. (APS), and provide better electrical and thermal performance in a smaller footprint than wire-bond package technology, AIT claimed.
The FCOSL packages are available in small outline integrated circuits (SOIC), thin shrink small outline package (TSSOP), single in-line package (SIP) and quad flat package (xQFP) configurations, the company said. The packaging uses perimeter or flip-chip pads that connect the IC die to a copper substrate.
The package is able to withstand higher processing temperatures up to 260 degrees celsius, enabling the package to be assembled more quickly than other packages, the company said. In addition the FCOSL packaging can be configured to be be pin-compatible with existing designs, the company said.
AIT did not quantify the thermal or electrical performance of FCOSL or compare it with other package styles. AIT is currently qualifying the FCOSL packaging with several customers, the company said.
