United Business Media EE Times




Search

HOMELATEST NEWSSEMICONDUCTORSMOST POPULARMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSS

 

Analyst claims foundry capacity shortages are 'fake'








Silicon Strategies


SAN JOSE -- Is the silicon foundry industry creating what appears to be "fake" or artificial shortages of leading-edge fab capacity?

Word on the street is that the market--if not the foundries themselves--may be pumping up the business to make a potential killing on inflated wafer prices in the near future.

In a report issued by SG Cowen Securities Corp. this week, for example, the investment banking firm warned that Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) will not be able to ramp up its leading-edge fab capacity fast enough to meet demand in the second half of the year. By leading-edge fab capacities, the report implied 0.15- to 0.13-micron process technologies.

At the same time, major foundries--including Chartered, IBM, TSMC, and UMC--have separately reported sharp increases in their respective fab capacities. And most have dropped hints that their leading-edge capacities are or will become tight.

So buy your wafers now and fast.

But hang on! Some charge that the perceived shortages of leading-edge capacities are simply "fake." "The foundries are saying that they are getting tight at the leading-edge processes, as well as trailing-edge technologies like 0.35-micron and better," said Len Jelinek, an analyst at iSuppli Corp. in El Segundo, Calif.

"I think these are contrived shortages," Jelinek declared. "It's fake."

While silicon foundries are warning about potential shortages, they are not exactly expanding their fabs with new and advanced tools; instead, they scrambling to utilize their existing fab capacities, he said. Many providers are sitting on one (or more) under-utilized fab or "empty shell" and are reluctant to move in the tool set, he said.

At its recent technology conference, for example, TSMC admitted that it has plenty of 300-mm capacity on the table. At present, the foundry giant has three 300-mm fab: Fab 12A, 12B, and 14.

TSMC plans to expand the production of its Fab 12A plant from 6,000 wafers a month, to 14,000 by year's end. Capable of making 25,000 wafers a month, Fab12A is a 0.15- to 0.13-micron plant. It has also completed the shell and cleanroom for Fab12B, but the company has yet to install the equipment. The fab is capable of making 25,000 wafers a month, plus 5,000 more for R&D.

It has also completed the shell for the company's Fab14 plant. Capable of making 35,000 wafers a month, the company expects that Fab14 will move into production in 2003 (see April 23 story ).

"I think you can arguably ask the foundries: 'Why aren't you buying any new tools to build up your 12-inch fab? They would say: 'It's economics,' " he said.

Indeed, the demand picture looks cloudy for the second half of 2003. Some believe the sudden surge for foundry services is more of an inventory replenishment issue verses real end-user demand in the marketplace.

So, as usual, the foundries are caught in a vice. On one hand, the foundries face pressure from customers to expand their capacities. And on the other hand, they face a major risk if the business does not materialize. "They could fall off the cliff in either direction," according to the iSuppli analyst.











  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Ready for a change?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
10 Search Engines You Don't Know About
Go beyond Google and get vertical. These specialized search sites will help you find the business information you need -- fast.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   


  Around Silicon Strategies

Video--Khosla speaks: The fundamental value of new technology ideas remains sound despite the unfolding economic crisis, said veteran venture capitalist Vinod Khosla, outlining opportunities he sees in so-called clean technologies. More...

10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

Qualcomm leaps: Qualcomm used a 27 percent year-over-year growth rate to jump to ninth among the largest semiconductor suppliers through the first three quarters of 2008, according to a top 20 ranking compiled by IC Insights. More...

35 people, places & things: We are witnessing the integration of technology with society to an unprecedented degree. In this special report, we offer a glimpse of the next 35 years--what's coming down the pike, and how we might begin to make sense of it. More...

Top 10 predictions for semis in 2008: To help sort out chip market confusion, EE Times semiconductor editor Mark LaPedus offers his own chip forecasts--and other predictions--for 2008. So, what will happen to AMD, Freescale, IBM Micro, SMIC and others? More...

Video--Qualcomm's Brew: Qualcomm has made available a software development kit (SDK) for the company's Brew Mobile Platform, a mobile operating system platform that supports handsets and mobile devices across 3G technologies. More...

Silicon 60 version 7.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 7.0 to reflect the latest corporate, commercial, technology and market conditions. More...

 

FEATURED TOPIC



ADDITIONAL TOPICS












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2008 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Your California Privacy Rights | Terms of Service | About